L-3 Communications Infrared Products is introducing an uncooled focal plane array (FPA) with 1024 x 768 pixel resolution. When integrated into thermal viewing modules, the new thermal sensor will offer significantly longer viewing range, with appreciably greater scene detail and considerably more capable electronic zoom. As an uncooled module the new FPA will cost significantly less than comparable high-resolution cooleds. The 1024 x 768 BFE262 FPA was developed by prime contractor Black Forest Engineering (BFE) on a Phase II SBIR for NASA Langley. The new product will be manufactured with L-3’s new 17 micron technology. Production is expected to begin in the next 12 to 18 months.